apex microtechnology develops and manufactures precision power analog monolithic, hybrid and open frame components for a wide range of industrial, test and measurement, medical, aerospace and defense applications.
| Part Number | MS05 |
|---|---|
| Part Status | Active |
| Type | DIP, 1.2" (30.48mm) Row Spacing |
| Number of Positions or Pins (Grid) | 12 (2 x 6) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyester, Glass Filled |
| Operating Temperature | - |
Manufacturer: Toshiba Semiconductor and Storage
Description: FERRITE CORE SOLID 12.8MM
In Stock: 457
