apex microtechnology develops and manufactures precision power analog monolithic, hybrid and open frame components for a wide range of industrial, test and measurement, medical, aerospace and defense applications.
| Artikelnummer | MS06 |
|---|---|
| Teilstatus | Active |
| Art | SIP |
| Anzahl der Positionen oder Pins (Raster) | 20 (1 x 20) |
| Pitch - Paarung | 0.100" (2.54mm) |
| Kontakt Finish - Paarung | Gold |
| Kontakt Finish Dicke - Paarung | 30µin (0.76µm) |
| Kontaktmaterial - Paarung | Beryllium Copper |
| Befestigungsart | Through Hole |
| Eigenschaften | Closed Frame |
| Beendigung | Solder |
| Pitch - Posten | 0.100" (2.54mm) |
| Kontakt Finish - Beitrag | Tin |
| Kontakt Finish Dicke - Beitrag | 200µin (5.08µm) |
| Kontaktmaterial - Post | Brass |
| Gehäusematerial | Polyester, Glass Filled |
| Betriebstemperatur | - |
Hersteller: Toshiba Semiconductor and Storage
Beschreibung: FERRITE CORE SOLID 12.8MM
Auf Lager: 457
