Part Number | BDN11-3CB/A01 |
---|---|
Part Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Included) |
Shape | Square, Pin Fins |
Length | 1.110" (28.19mm) |
Width | 1.110" (28.19mm) |
Diameter | - |
Height Off Base (Height of Fin) | 0.355" (9.02mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 7.2°C/W @ 400 LFM |
Thermal Resistance @ Natural | 20.9°C/W |
Material | Aluminum |
Material Finish | Black Anodized |
Manufacturer: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.11"SQ
In Stock: 2218