chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Part Number | BGA0010 |
|---|---|
| Part Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | BGA |
| Number of Positions | 42 |
| Pitch | 0.020" (0.50mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 2.100" (17.78mm x 53.34mm) |
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