Part Number | 44-547-11 |
---|---|
Part Status | Active |
Type | SOIC, ZIF (ZIP) |
Number of Positions or Pins (Grid) | 44 (2 x 22) |
Pitch - Mating | - |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 20µin (0.51µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.050" (1.27mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 20µin (0.51µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature | - |
Manufacturer: Amphenol Sine Systems Corp
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