chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| 부품 번호 | SMDSWLF.031 2OZ |
|---|---|
| 부품 상태 | Active |
| 유형 | Wire Solder |
| 녹는 점 | 423 ~ 428°F (217 ~ 220°C) |
| 방법 | Lead Free |
| 구성 | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
| 플럭스 유형 | No-Clean |
| 직경 | 0.031" (0.79mm) |
| 전선 게이지 | 20 AWG, 21 SWG |
| 코어 크기 | 0.022 |
| 형태 | Spool, 57g (2 oz) |
| 유통 기한 | No Shelf Life |
