chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| 部品番号 | SMDSWLF.031 2OZ |
|---|---|
| 部品ステータス | Active |
| タイプ | Wire Solder |
| 融点 | 423 ~ 428°F (217 ~ 220°C) |
| プロセス | Lead Free |
| 組成 | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
| フラックスタイプ | No-Clean |
| 直径 | 0.031" (0.79mm) |
| ワイヤゲージ | 20 AWG, 21 SWG |
| コアサイズ | 0.022 |
| 形 | Spool, 57g (2 oz) |
| 賞味期限 | No Shelf Life |
