cts electronic components provides customers with platform-based engineered components and modules, and related products.
| Numéro d'article | BDN09-3CB |
|---|---|
| État de la pièce | Active |
| Type | Top Mount |
| Paquet refroidi | Assorted (BGA, LGA, CPU, ASIC...) |
| Méthode de fixation | Thermal Tape, Adhesive (Not Included) |
| Forme | Square, Pin Fins |
| Longueur | 0.910" (23.11mm) |
| Largeur | 0.910" (23.11mm) |
| Diamètre | - |
| Hauteur hors base (hauteur de l'ailette) | 0.355" (9.02mm) |
| Dissipation de puissance @ Augmentation de la température | - |
| Résistance thermique @ Débit d'air forcé | 9.6°C/W @ 400 LFM |
| Résistance thermique @ Naturel | 26.9°C/W |
| Matériel | Aluminum |
| Finition matérielle | Black Anodized |
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE .91"SQ
En stock: 1340
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.01"SQ
En stock: 290
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.01"SQ
En stock: 0
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.11"SQ
En stock: 2218
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.21"SQ
En stock: 1053
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.21"SQ
En stock: 961
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.31"SQ
En stock: 2443
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.41"SQ
En stock: 428
Fabricant: CTS Thermal Management Products
La description: HEATSINK CPU W/ADHESIVE 1.51"SQ
En stock: 0
