Part Number | 828-AG11D |
---|---|
Part Status | Active |
Type | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 25µin (0.63µm) |
Contact Material - Mating | Copper Alloy |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin-Lead |
Contact Finish Thickness - Post | 80µin (2.03µm) |
Contact Material - Post | Copper Alloy |
Housing Material | Polyester |
Operating Temperature | -55°C ~ 105°C |
Manufacturer: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD
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Manufacturer: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD
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Manufacturer: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD
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Manufacturer: TE Connectivity AMP Connectors
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