cts electronic components provides customers with platform-based engineered components and modules, and related products.
| Numero de parte | BDN09-3CB/A01 |
|---|---|
| Estado de la pieza | Active |
| Tipo | Top Mount |
| Paquete refrigerado | Assorted (BGA, LGA, CPU, ASIC...) |
| Método de apego | Thermal Tape, Adhesive (Included) |
| Forma | Square, Pin Fins |
| Longitud | 0.910" (23.11mm) |
| Anchura | 0.910" (23.11mm) |
| Diámetro | - |
| Altura de la base (altura de la aleta) | 0.355" (9.02mm) |
| Disipación de potencia @ Aumento de temperatura | - |
| Resistencia térmica @ Flujo de aire forzado | 9.6°C/W @ 400 LFM |
| Resistencia térmica @ Natural | 26.9°C/W |
| Material | Aluminum |
| Acabado material | Black Anodized |
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK CPU W/ADHESIVE .91"SQ
En stock: 1340
