cts electronic components provides customers with platform-based engineered components and modules, and related products.
| Numero de parte | APF30-30-10CB |
|---|---|
| Estado de la pieza | Active |
| Tipo | Top Mount |
| Paquete refrigerado | Assorted (BGA, LGA, CPU, ASIC...) |
| Método de apego | Thermal Tape, Adhesive (Not Included) |
| Forma | Square, Fins |
| Longitud | 1.181" (30.00mm) |
| Anchura | 1.181" (30.00mm) |
| Diámetro | - |
| Altura de la base (altura de la aleta) | 0.370" (9.40mm) |
| Disipación de potencia @ Aumento de temperatura | - |
| Resistencia térmica @ Flujo de aire forzado | 3.3°C/W @ 200 LFM |
| Resistencia térmica @ Natural | - |
| Material | Aluminum |
| Acabado material | Black Anodized |
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK LOW-PROFILE FORGED
En stock: 233
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK FORGED W/ADHESIVE TAPE
En stock: 1244
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK LOW-PROFILE FORGED
En stock: 200
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK FORGED W/ADHESIVE TAPE
En stock: 1692
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK LOW-PROFILE FORGED
En stock: 409
Fabricante: CTS Thermal Management Products
Descripción: HEATSINK FORGED W/ADHESIVE TAPE
En stock: 2750
