established in 1957, wakefield engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets.
| Part Number | 658-25ABT2 |
|---|---|
| Part Status | Obsolete |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Pin Fins |
| Length | 1.100" (27.94mm) |
| Width | 1.100" (27.94mm) |
| Diameter | - |
| Height Off Base (Height of Fin) | 0.250" (6.35mm) |
| Power Dissipation @ Temperature Rise | 2W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 5°C/W @ 500 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |
Manufacturer: Wakefield-Vette
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Description: HEATSINK CPU 28MM SQ BLK W/TAPE
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