Part Number | APF19-19-13CB/A01 |
---|---|
Part Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Included) |
Shape | Square, Fins |
Length | 0.748" (19.00mm) |
Width | 0.748" (19.00mm) |
Diameter | - |
Height Off Base (Height of Fin) | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 4.0°C/W @ 200 LFM |
Thermal Resistance @ Natural | - |
Material | Aluminum |
Material Finish | Black Anodized |
Manufacturer: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
In Stock: 0
Manufacturer: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
In Stock: 1228
Manufacturer: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
In Stock: 475
Manufacturer: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
In Stock: 1994
Manufacturer: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
In Stock: 0
Manufacturer: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
In Stock: 6634