Part Number | 30-9503-21 |
---|---|
Part Status | Active |
Type | DIP, 0.9" (22.86mm) Row Spacing |
Number of Positions or Pins (Grid) | 30 (2 x 15) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Wire Wrap |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 10µin (0.25µm) |
Contact Material - Post | Phosphor Bronze |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature | -55°C ~ 125°C |
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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