Part Number | 08-2513-10 |
---|---|
Part Status | Active |
Type | DIP, 0.2" (5.08mm) Row Spacing |
Number of Positions or Pins (Grid) | 8 (2 x 4) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 200µin (5.08µm) |
Contact Material - Post | Brass |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature | - |
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 39
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0