chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| 부품 번호 | PA0101 |
|---|---|
| 부품 상태 | Active |
| 프로토 보드 유형 | SMD to DIP |
| 허용되는 패키지 | LGA |
| 위치 개수 | 14 |
| 피치 | 0.031" (0.80mm) |
| 보드 두께 | 0.062" (1.57mm) 1/16" |
| 자료 | FR4 Epoxy Glass |
| 크기 / 치수 | 0.700" x 0.700" (17.78mm x 17.78mm) |
