chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| 부품 번호 | IPC0170-S |
|---|---|
| 부품 상태 | Active |
| 유형 | BGA |
| 위치 개수 | 24 |
| 피치 | 0.039" (1.00mm) |
| 외형 치수 | 0.900" L x 1.300" W (22.86mm x 33.02mm) |
| 내부 치수 | 0.315" L x 0.236" W (8.00mm x 6.00mm) |
| 열 센터 패드 | - |
| 자료 | Stainless Steel |
