chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
제조사: Chip Quik Inc.
기술: POWERPAD-24/POWERSOIC-24 (1.27MM
재고: 0
기술: POWERPAD-28/POWERSOIC-28 (1.27MM
기술: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
기술: QFN-28/LFCSP-28 (0.5MM PITCH, 5.
기술: QFN-28/LFCSP-28 (0.65MM PITCH, 6
기술: RN4020 (1.2MM PITCH, 19.5X11.5MM
기술: RN42 (1.2MM PITCH, 25.8X13.4MM B
기술: QFN-36/LFCSP-36 (5 CENTER PADS)
기술: PLCC-68/JLCC-68/LCC-68 (1.27MM P
기술: PLCC-84/JLCC-84/LCC-84 (1.27MM P
기술: LQFP-128/PQFP-128 (0.5MM PITCH,
기술: LQFP-128 (0.5MM PITCH, 20X20MM B
기술: LQFP-176 (0.5MM PITCH, 24X24MM B
기술: TQFP-128 (0.4MM PITCH, 14X14MM B
기술: TQFP-160 (0.5MM PITCH, 24X24MM B
기술: PQFP-100 (0.65MM PITCH, 14X20MM
기술: PQFP-160 (0.65MM PITCH, 28X28MM
기술: RQFP-240 (0.5MM PITCH, 32X32MM B
기술: TQFP-144 (0.4MM PITCH, 16X16MM B
기술: TQFP-80 (0.8MM PITCH, 14X20MM BO
기술: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
기술: DFN-12 (0.4MM PITCH, 3X3MM BODY)
기술: TSSOP-44 (0.64MM PITCH, 14X6.1MM
기술: DFN-10 (0.4MM PITCH, 2X2MM BODY)
기술: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
기술: DFN-22 (0.5MM PITCH, 6X3MM BODY)
기술: MQFP-44 (0.8MM PITCH, 10X10MM BO
기술: LGA-10 (0.65MM PITCH, 3X3MM BODY
기술: LLP-32 STENCIL
기술: LLP-36 STENCIL
기술: LLP-40 STENCIL
기술: LLP-44 STENCIL
기술: LLP-48 STENCIL
기술: LLP-54 STENCIL
기술: LLP-56 STENCIL
기술: LLP-6 STENCIL
기술: LLP-60 STENCIL
기술: LLP-64 STENCIL
기술: LLP-68 STENCIL
기술: LLP-8 BODY STENCIL
기술: LQFP-40 STENCIL
기술: LQFP-48 STENCIL
기술: LSOP-10 STENCIL
기술: MICROSMD-10 STENCIL
기술: MICROSMD-14 STENCIL
기술: MICROSMD-4 STENCIL
기술: MICROSMD-5 STENCIL
기술: MICROSMD-6 STENCIL
기술: MICROSMD-8 STENCIL
