chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| 部品番号 | F127T254P04 |
|---|---|
| 部品ステータス | Active |
| プロトボードタイプ | Plated Through Hole to Plated Through Hole |
| 受け入れられたパッケージ | - |
| ポジション数 | 4 |
| ピッチ | 0.050" (1.27mm) |
| ボード厚さ | 0.063" (1.60mm) |
| 材料 | FR4 Epoxy Glass |
| サイズ/寸法 | - |
