laird technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
| Numéro d'article | A14399-02 |
|---|---|
| État de la pièce | Active |
| Type | Non-Silicone Compound |
| Taille / Dimension | 30cc Syringe |
Fabricant: Assmann WSW Components
La description: CONN IC DIP SOCKET 14POS GOLD
En stock: 0
Fabricant: Microsemi Corporation
La description: IC FPGA 228 I/O 313BGA
En stock: 0
Fabricant: Microsemi Corporation
La description: IC FPGA 228 I/O 256CQFP
En stock: 0
Fabricant: Microsemi Corporation
La description: IC FPGA 228 I/O 256CQFP
En stock: 0
Fabricant: Microsemi Corporation
La description: IC FPGA 228 I/O 256CQFP
En stock: 0
Fabricant: Microsemi Corporation
La description: IC FPGA 228 I/O 257CPGA
En stock: 0
Fabricant: Microsemi Corporation
La description: IC FPGA 228 I/O 257CPGA
En stock: 0
