Numéro d'article | SMDLTLFP250T4 |
---|---|
État de la pièce | Active |
Type | Solder Paste |
Point de fusion | 281°F (138°C) |
Processus | Lead Free |
Composition | Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
Type de flux | No-Clean |
Diamètre | - |
Calibre du fil | - |
Taille du noyau | - |
Forme | Jar, 250g (9 oz) |
Durée de conservation | 6 Months (Date of Manufacture) (Refrigerated) |
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