| Numéro d'article | ATS-11F-101-C2-R0 |
|---|---|
| État de la pièce | Active |
| Type | Top Mount |
| Paquet refroidi | Assorted (BGA, LGA, CPU, ASIC...) |
| Méthode de fixation | Push Pin |
| Forme | Square, Fins |
| Longueur | 1.772" (45.00mm) |
| Largeur | 1.772" (45.00mm) |
| Diamètre | - |
| Hauteur hors base (hauteur de l'ailette) | 1.181" (30.00mm) |
| Dissipation de puissance @ Augmentation de la température | - |
| Résistance thermique @ Débit d'air forcé | 6.69°C/W @ 100 LFM |
| Résistance thermique @ Naturel | - |
| Matériel | Aluminum |
| Finition matérielle | Blue Anodized |
Fabricant: Advanced Thermal Solutions Inc.
La description: 1/4 BRICK HEATSINK 58X37X22.9MM
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Fabricant: Advanced Thermal Solutions Inc.
La description: FULL BRICK HEATSINK 117X61X6.1MM
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Fabricant: Advanced Thermal Solutions Inc.
La description: FULL BRICK HEATSINK 117X61X11.4M
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