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| Artikelnummer | IC-628-SGG |
|---|---|
| Teilstatus | Active |
| Art | DIP, 0.6" (15.24mm) Row Spacing |
| Anzahl der Positionen oder Pins (Raster) | 28 (2 x 14) |
| Pitch - Paarung | 0.100" (2.54mm) |
| Kontakt Finish - Paarung | Gold |
| Kontakt Finish Dicke - Paarung | 30µin (0.76µm) |
| Kontaktmaterial - Paarung | Beryllium Copper |
| Befestigungsart | Through Hole |
| Eigenschaften | Open Frame |
| Beendigung | Solder |
| Pitch - Posten | 0.100" (2.54mm) |
| Kontakt Finish - Beitrag | Gold |
| Kontakt Finish Dicke - Beitrag | 30µin (0.76µm) |
| Kontaktmaterial - Post | Phosphor Bronze |
| Gehäusematerial | Polyester, Glass Filled |
| Betriebstemperatur | -55°C ~ 125°C |
Hersteller: Samtec Inc.
Beschreibung: CONN IC DIP SOCKET 28POS GOLD
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