chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Artikelnummer | PA0107SOCKET |
|---|---|
| Teilstatus | Active |
| Proto-Brett-Typ | SMD to DIP |
| Paket akzeptiert | LCC, JLCC, PLCC |
| Anzahl der Positionen | 44 |
| Tonhöhe | 0.050" (1.27mm) |
| Plattendicke | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Größe / Dimension | 1.000" x 2.200" (25.40mm x 55.88mm) |
