Part Number | 290-1294-00-3302J |
---|---|
Part Status | Active |
Type | DIP, ZIF (ZIP) |
Number of Positions or Pins (Grid) | 90 (2 x 45) |
Pitch - Mating | 0.070" (1.78mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30µin (0.76µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.070" (1.78mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 30µin (0.76µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polysulfone (PSU), Glass Filled |
Operating Temperature | -55°C ~ 125°C |
Manufacturer: 3M
Description: CONN IC DIP SOCKET ZIF 90POS GLD
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Manufacturer: 3M
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