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| Part Number | 228-7396-55-1902 |
|---|---|
| Part Status | Active |
| Type | SOIC |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Pitch - Mating | - |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30µin (0.76µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Operating Temperature | -55°C ~ 150°C |
Manufacturer: 3M
Description: CONN SOCKET SOIC 28POS GOLD
In Stock: 318
