cts electronic components provides customers with platform-based engineered components and modules, and related products.
| Numéro d'article | APF30-30-06CB/A01 |
|---|---|
| État de la pièce | Active |
| Type | Top Mount |
| Paquet refroidi | Assorted (BGA, LGA, CPU, ASIC...) |
| Méthode de fixation | Thermal Tape, Adhesive (Included) |
| Forme | Square, Fins |
| Longueur | 1.181" (30.00mm) |
| Largeur | 1.181" (30.00mm) |
| Diamètre | - |
| Hauteur hors base (hauteur de l'ailette) | 0.250" (6.35mm) |
| Dissipation de puissance @ Augmentation de la température | - |
| Résistance thermique @ Débit d'air forcé | 4.4°C/W @ 200 LFM |
| Résistance thermique @ Naturel | - |
| Matériel | Aluminum |
| Finition matérielle | Black Anodized |
Fabricant: CTS Thermal Management Products
La description: HEATSINK LOW-PROFILE FORGED
En stock: 233
Fabricant: CTS Thermal Management Products
La description: HEATSINK FORGED W/ADHESIVE TAPE
En stock: 1244
Fabricant: CTS Thermal Management Products
La description: HEATSINK LOW-PROFILE FORGED
En stock: 200
Fabricant: CTS Thermal Management Products
La description: HEATSINK FORGED W/ADHESIVE TAPE
En stock: 1692
Fabricant: CTS Thermal Management Products
La description: HEATSINK LOW-PROFILE FORGED
En stock: 409
Fabricant: CTS Thermal Management Products
La description: HEATSINK FORGED W/ADHESIVE TAPE
En stock: 2750
