chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Numéro d'article | SMDLTLFP50T3 |
|---|---|
| État de la pièce | Active |
| Type | Solder Paste |
| Point de fusion | 281°F (138°C) |
| Processus | Lead Free |
| Composition | Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
| Type de flux | No-Clean |
| Diamètre | - |
| Calibre du fil | - |
| Taille du noyau | - |
| Forme | Jar, 50g (1.8 oz) |
| Durée de conservation | 6 Months (Date of Manufacture) (Refrigerated) |
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