| Part Number | 40-6552-18 |
|---|---|
| Part Status | Active |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Nickel Boron |
| Contact Finish Thickness - Mating | 50µin (1.27µm) |
| Contact Material - Mating | Beryllium Nickel |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Nickel Boron |
| Contact Finish Thickness - Post | 50µin (1.27µm) |
| Contact Material - Post | Beryllium Nickel |
| Housing Material | Polyetheretherketone (PEEK), Glass Filled |
| Operating Temperature | -55°C ~ 250°C |
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
In Stock: 0
Manufacturer: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
In Stock: 0