Home Manufacturers RF360 - A Qualcomm-TDK joint venture
RF360 - A Qualcomm-TDK joint venture

RF360 - A Qualcomm-TDK joint venture

- We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.

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