cts electronic components provides customers with platform-based engineered components and modules, and related products.
| Part Number | APF30-30-10CB |
|---|---|
| Part Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square, Fins |
| Length | 1.181" (30.00mm) |
| Width | 1.181" (30.00mm) |
| Diameter | - |
| Height Off Base (Height of Fin) | 0.370" (9.40mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 3.3°C/W @ 200 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |
Manufacturer: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
In Stock: 233
Manufacturer: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
In Stock: 1244
Manufacturer: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
In Stock: 200
Manufacturer: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
In Stock: 1692
Manufacturer: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
In Stock: 409
Manufacturer: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
In Stock: 2750
